A scanning electron microscopic study of enamel surface by debracketing of ceramic bracket

Park, Mi Suk; Yoon, Young Jooh; Kim, Kwang Won

Abstract

The purposes of this study were to evaluate and compare the frequency of ceramic bracket fracture, frequency of enamel fracture, bond fracture site, adhesive remnant index after mechanical and electrothermal debracketing, to evaluate effectiveness of high and low speed rotary instrument and ultrasonic instrument during residual adhesive remnants removal, and to measure resin film surface(percentage) using by image artalyser(Leco 300). Bond fracture site, bracket fracture, and enamel surface damage were examined by scanning electron microscope. The following results were obtained: 1. In the mechanical debracketing group, the bond failed predominantly at enamel-adhesive interface with the bulk of adhesive remaining on bracket base. 2. In the eletrothermal debracketing group, the bond failed predominantly at adhesive-bracket interface with the bulk of adhesive remaining on enamel surface. 3. The most effectiveness of residual resin removal was obtained by means of the resin polishing bur and the order of scratch formation was the precedure using tungsten carbide bur, ultrasonic scaler, sot-lex disc, and polishing bur. 4. The order of the resin film surface percentage was ultrasonic scaler, tungsten carbide bur, sot-lex disc, and resin polishing bur.