Korean J Orthod.  2001 Aug;31(4):459-465.

Bond strength according to the adhesive type and the distance between enamel surface and resin base in indirect bonding

Affiliations
  • 1Department of Orthodontics, College of Dentistry, Dental Science Research Institute, Chonnam National University, Korea. hhwang@chonnam.ac.kr

Abstract

The purpose of this study was to evaluate the feasibility of the combined use of paste resin with sealant as an adhesive of the indirect bonding. The resin bases made of light-cured resin were bonded to the bovine incisors at a distance of 0.0, 0.2 or 0.4 mm using the sealant only or the mixture of sealant and paste resin. Bond strength of each group was measured using universal testing machine. The results were as follows : 1. The bond strength was reduced in both groups as the distance between enamel surface and resin base increased. 2. The bond strength showed no statistical difference between two groups in case the distance between enamel surface and resin base was 0.0 mm. 3. In case the distance between enamel surface and resin base was 0.2 or 0.4 mm, the sealant with paste resin group showed significantly higher bond strength than the sealant only group. The results of the present study indicate that the use of paste resin with sealant may be desirable as an adhesive in indirect bonding, particularly in case a gap is suspected between enamel surface and resin base.

Keyword

Indirect bonding; Bond strength; Adhesive; Resin base

MeSH Terms

Adhesives*
Dental Enamel*
Incisor
Adhesives
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