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The shear bond strength and adhesive failure pattern in bracket bonding with different light-curing methods

Shin JH, Lim YK, Lee DY

  • KMID: 2074784
  • Korean J Orthod.
  • 2004 Aug;34(4):333-342.
The purpose of this study was to evaluate the clinical effectiveness of a plasma arc light and light emitting diode (LED), compared with shear bond strength and the failure pattern...
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