- The shear bond strength and adhesive failure pattern in bracket bonding with different light-curing methods
-
Shin JH, Lim YK, Lee DY
- KMID: 2074784
- Korean J Orthod.
- 2004 Aug;34(4):333-342.
The purpose of this study was to evaluate the clinical effectiveness of a plasma arc light and light emitting diode (LED), compared with shear bond strength and the failure pattern... -
- CITED
-
- Close
- SHARE
-
- Close
