Skip Navigation
Skip to contents



5 results

Rhombus Subcutaneous Pedicle Skin Flap for Reconstruction of Linear Depressed Postburn Scar Band

Kim DC, Kim JH, Yu SH, Shin CH, Lee CK

  • J Korean Burn Soc.
  • 2020 Jun;23(1):25-29.
This paper presents our clinical experiences for reconstruction of the linear depressed postburn scar band by rhombus subcutaneous pedicle skin flap (RSPF). We report new RSPF, it’s versatility, and effectiveness...
Fragmented Split-Thickness Skin Graft Using a Razor Blade in Burn Induced Diabetic Foot

Park CH, Choi M, Kang CS, Kim TG

  • J Korean Burn Soc.
  • 2020 Jun;23(1):20-24.
Diabetic patients have an increased risk of burn injuries on foot. Because of their diabetic neuropathy, they could contact with hot water or warming device without being aware of it....
Immediate Fasciotomy for Acute Thermal Contact Burn Combined with Compression Injury of the Right Forearm and Hand: A Case Report

Jung SW, Lee S, Yoo KT

  • J Korean Burn Soc.
  • 2020 Jun;23(1):13-19.
Treatment of compartment syndrome is early decompressive fasciotomy to prevent dreadful sequelae of ischemic necrosis of muscles and nerves. We experienced one patient of impending or early compartment syndrome of...
A Clinical Study on Recent Causing Agents of Chemical Burns

Shin CH, Yu SH, Kim JH, Kim DC

  • J Korean Burn Soc.
  • 2020 Jun;23(1):7-12.
Purpose: Due to rapid changes in the industrial structure in last decade, the wider various types of chemical agents were introduced. Burn surgeons should be well-informed with rapid changes of...
Serum Lactate, Creatinine and Urine Output: Early Predictors of Mortality after Initial Fluid Resuscitation in Severe Burn Patients

Oh S, Kym D

  • J Korean Burn Soc.
  • 2020 Jun;23(1):1-6.
Purpose: PL, creatinine and urine output are biomarkers of the suitability and prognosis of fluid therapy in severe burn patients. The purpose of this study is to evaluate the usefulness...

Go to Top

Copyright © 2020 by Korean Association of Medical Journal Editors. All rights reserved.     E-mail: